PACK EXPO 2021, Las Vegas

CoreTigo will be lecturing about innovative packaging machinery technologies and applications at the “PACK to the Future” Stage – at PACK EXPO 2021, Las Vegas.

We’ll discuss how IO-Link Wireless enables packaging machinery to address the challenging requirements of:

  • Supporting the broad range of package variations (size, weight, shape, material) within a single machine
  • Reducing and eliminating changeover and setup time between different package types
  • Increasing machine capacity by performing actions while in constant motion
  • Predictive maintenance & downtime reduction
  • Machine footprint reduction

For more details contact us >>